In this study, we aim to systematically develop a new process to prepare front side metal lines in industrial silicon solar cells via electrochemical techniques. In particular, two topics are included.
In the first part of this proposal, we start with silicon wafer surface modification, followed by catalyst adsorption, and then prepare seed metal layer by electroless deposition and finish off by electroplating conducting metal layers. All the processes associated with relative inspection methods will be investigated and evaluated. In addition, the structural and electronic properties of as-prepared metal lines will be analyzed and compared with the conventional screen-printed silver line.
The second part of this proposal focuses on the analysis of metal/silicon interface, including conventional silver/silicon interface and as-deposited metal/silicon interface by means of intermetallic inspection technique. These two sub-projects will be undertaken concurrently for better understanding and fast development of new metal contact for industrial solar cell. By close cooperation with Gintech Technology, we expect to approach industrial needs during the project execution and deliver final findings to the industry after the project is completed.
(SEM images showing the cross section of Ni-P layer in different annealing temperature)